Modification of transperant and brittle materials



Cleaving refers to the local modification of transparent workpieces like glass, fused silica or sapphire in order to release material along the introduced modification in a subsequent process.

Advantages of this method over conventional mechanical processes exist in a micro structure modification in the complete volume of the material. This allows crack formation to be controlled in all spatial directions so that a homogeneous and vertical fracture edge with low roughness (Ra <0.5 µm) is generated. In this way arched fractures can also be achieved.

Through the low roughness of the broken edges there is no reduction of the bending stiffness by microcracks and because of this ablation-free-process there are no considerable condensates gener-ated.

The combination with the GL.rotil module enables the possibility to process workpieces with five-axes simultaneously movement.




Glass modification
  • Thickness: 0,1mm to 2,0mm (<5,0mm @ 500µJ)
  • Ra: <0.5 µm
  • Feed rate: Up to 2 m/s
  • Material: Hardened and unhardened thin glasses, sapphire, fused silica and many other brittle and transparent materials




Glas modification
Glas cutting
Brittle glas modification